1 首先制作flash
1）制作焊盘前先计算好各项数据
thermal relief（热风焊盘）：内径（ID）= 孔径 +20mil 外径（OD）= Anti_pad的直径= Regular pad + 20mil 开口宽度Spoke width = （ OD - ID ）/2 +10mil
过孔的孔径 Drill_Size = 0.9mm ， ID = 1.4mm , OD = Regular pad + 20mil = Drill_Size × 1.5 + 20mil = 1.4mm +20mil = 1.9mm
Spoke width = 0.5mm .
2) 打开 PCB Editor -> File -> New ,根据命名规则如下
3）Add -> Flash
保存，flash绘制完毕。
2 制作过孔
1）计算
Drill_Size >= Physical_Pin_Size+10mil = 0.9mm Regular pad = Drill_Size × 1.5 = 1.4mm
Anti_pad （ 隔离焊盘 ） ：Regular pad + 20mil = 1.9mm
paste Mask （ 焊锡层 ）= Regular pad(正规焊盘）
solder Mask （ 阻焊层 ）= Regular pad(正规焊盘）+ 6 mil = 1.6mm
2) 打开pad editor,新建一个焊盘，设置如下
保存，焊盘制作完毕