读数据手册,看到了几种不同封装的描述。记录一下。

几种芯片封装

QFP

QFP是指四方扁平式封装技术(Quad Flat Package),该技术实现的CPU芯片引脚之间距离很小,管脚很细。

几种芯片封装

几种芯片封装
几种芯片封装

QFP 有多种变种:

  • BQFP: Bumpered Quad Flat Package
  • BQFPH: Bumpered Quad Flat Package with heat spreader
  • CQFP: Ceramic Quad Flat Package
  • EQFP: Plastic Enhanced Quad Flat Package
  • FQFP: Fine Pitch Quad Flat Package
  • LQFP: Low Profile Quad Flat Package
  • MQFP: Metric Quad Flat Package
  • NQFP: Near chip-scale Quad Flat Package.
  • SQFP: Small Quad Flat Package
  • TQFP: Thin Quad Flat Package
  • VQFP: Very small Quad Flat Package
  • VTQFP: Very Thin Quad Flat Package
  • TDFP: Thin Dual Flat Package.

LQFP

Low-profile Quad Flat Package 薄型四方扁平封装

几种芯片封装

TQFP

thin quad flat pack 薄QFP

几种芯片封装

VFQFPN

几种芯片封装
几种芯片封装

UFQFPN

几种芯片封装


参考wikipedia

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